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Fast, Accurate 3D Parasitic Extraction

Ansys Q3D Extractor includes several solution types for parasitic extraction of electronic packages, touchscreens and power electronic converters

3D Quasi-static Field Solver

Ansys Q3D Extractor contains an advanced quasi-static 3D electromagnetic field solver based on the method of moments (MoM), and is accelerated by the fast multipole method (FMM). Results include proximity and skin effect, dielectric and ohmic loss, and frequency dependencies. Q3D Extractor easily and quickly provides 3D extraction of resistance (R), partial inductance (L), capacitance (C) and conductance (G).

2D Extractor: Cable and Transmission Line Field Solver

Ansys Q3D Extractor includes a powerful quasi-static 2D electromagnetic field solver that uses the finite element method (FEM) to determine the per-unit-length RLCG parameters for cable models, transmission lines, characteristic impedance (Z0) matrices, propagation speed, delay, attenuation, effective permittivity, differential and common-mode parameters, and near- and far-end crosstalk coefficients

Automatic Adaptive Meshing

Provides answers with user-specified accuracy with minimal setup effort or manual intervention with the mesh process.

High-Performance Computing

Ansys Electronics High-Performance Computing (HPC) solutions for electronics enables parallel processing for solving the toughest and most challenging models — models with great geometric detail, large systems and complex physics.

Multithreading

Electronics HPC takes advantage of multiple cores on a single computer to reduce solution time. Multithreading technology speeds up the initial mesh generation, matrix solves and field recovery.

Spectral Decomposition Method

The spectral decomposition method (SDM) accelerates frequency sweeps by distributing multiple frequency points in parallel over compute cores and nodes. You can use this method in tandem with multithreading to speed up extraction of individual frequency points, while SDM parallelizes multifrequency point extraction.

HPC in the Cloud

Ansys Cloud makes high-performance computing (HPC) extremely easy to access and use. It was developed in collaboration with Microsoft® Azure™, a leading cloud platform for HPC. Ansys Cloud has been integrated into Ansys Electronics Desktop, so you can access unlimited, on-demand computing power directly from the design environment.

Optimetrics

Parameterization and optimization are key enablers for Simulation-Driven Product Development. Parametric analysis provides a thorough understanding of the design space based on your design variables, so that you can make better engineering decisions. Optimization algorithms enable the software to automatically find better designs.

Parameterization and optimization capabilities include:

Parametric analysis

• User-specified range and number of steps for parameters
• Automatic analysis of parameter permutations
• Automated job management across multiple hardware platforms and reassembly of data for parametric tables and studies

Optimization

• User-selectable cost functions and goal objectives, including:
  • Quasi-Newton method
  • Sequential nonlinear programming (SNLP)
  • Integer-only sequential nonlinear programming

Multidomain System Modeling

Integrated modeling capability to analyze electromagnetic components within a systems environment.

Simplorer is a powerful platform for modeling, simulating and analyzing system-level digital prototypes integrated with Ansys Maxwell, Ansys HFSS, Ansys SIwave, and Ansys Q3D Extractor. Simplorer enables you to verify and optimize the performance of your software-controlled, multidomain systems. With flexible modeling capabilities and tight integration with Ansys 3D physics simulation, Simplorer provides broad support for assembling and simulating system-level physical models to help you connect conceptual design, detailed analysis and system verification.

Simplorer is ideal for electrified system design, power generation, conversion, storage and distribution applications, EMI/EMC studies and general multidomain system optimization and verification.

IBIS Package Model Extraction

Extracts signal and power ground parasitics for inclusion in IBIS models such as touch panel, bus bar, power inverter & converter and thin planes.

The ability to generate highly accurate reduced-order SPICE models for use in circuit simulation makes Ansys Q3D Extractor the ideal software to create IBIS package models. You can study crosstalk, ground bounce, interconnect delays and ringing, which helps you to understand the performance of high-speed electronic designs, such as multilayer printed circuit boards, advanced electronic packages and 3D on-chip passive components. In addition, Q3D Extractor is essential for extracting accurate electrical parasitics of critical interconnect components in the package (bondwires), on the board (critical nets), and for the connection path between the chip, package and board (i.e., connectors, cables, sockets and transmission lines).

Equivalent Circuit Model Creation

Automatically creates models for circuit simulation.

You can leverage Ansys Q3D Extractor to create equivalent circuit models (SPICE subcircuits/ladder-type lumped models). The type of model that Q3D Extractor produces depends on which solver was used. The 2D and 3D field solvers create common formats such as Simplorer SML, HSPICE Tabular W-Element, PSpice, Spectre, IBIS ICM/PKG models and Ansys CPP models.

Touch Screen Design

Extracts and optimizes RLC parasitics for touchscreen design.

With Q3D Extractor, you can solve design challenges by analyzing the RLCG matrix data of touchscreen devices. The ability to efficiently solve thin conductive layers, such as ITO, can accelerate solutions up to 22 times over traditional thick metal solution methods.

Power Converter Design

Optimizes inverter/converter architectures and minimizes bus inductance, overvoltage situations and short-circuit currents.

Ansys Q3D Extractor is ideal for designing power electronic equipment used in hybrid-electric technologies and power distribution applications to optimize inverter/converter architectures and minimize bus inductance, overvoltage situations and short-circuit currents. The software extracts resistance, partial inductance and capacitance parasitics from high-power bus bars, cables, and high-power inverter/converter modules, then inputs them into Ansys Twin Builder to study the EMI/EMC performance of a power electronic system. Links to Ansys Icepak and Ansys Mechanical enable you to study electrothermal stresses caused by electrical currents.